真空鍍膜、PVD鍍膜、光學鍍膜與表面處理的佼佼者-VTD-machines-超硬鍍膜-vacuum components-Hollow

Applications

Substrate pre-treatment
Etching by ion bombardment and activation through extraction of gas ions from the plasma
Thermal treatment
Heating by electron impact of substrates to be coated, substrates as anode of the gas discharge
Plasma supported coating processes
Hollow cathodes arc discharge evaporation
Anodic flash evaporation
High rate evaporation from resistor heated boats
High rate evaporation with electron beam guns (utilisation as plasma source)

Advantages

effective combination of metal vapour and plasma generation for anodic crucible or flash evaporation respectively
Evaporator and plasma parameters are independent of each other for the combination of conventional evaporators with hollow cathode plasma sources
Super positioning of several hollow cathode plasma sources with several anodes each for large area applications

Principle

High current low voltage arc discharge between one or more gas filled hollow cathodes and the associated anodes in the low pressure area from 5 x 10e-4to 5 x 10e-3 mbar.

Special feature

Through utilisation of the hollow cathode effect in combination with thermally stimulated electron emission and photo effect a very high internal plasma density is achieved. The electron component energy is within the area of the max. efficiency cross section of the impact ionisation.

Hollow cathode plasma source HV 05